Riga Chip Summit 2026 is the first chip dedicated summit in Latvia organised by the Latvian Chip Competence Centre (LCCC). The summit will bring together stakeholders from industry, academia, finance, competence centres, start-ups, and SMEs from the Nordic–Baltic region and the wider European ecosystem.
📅 13 May 2026 8:30–17:00
📍 Riga, Latvia at the VEF Kamerzāle Spīdola.
🗣️ The working language of the forum is English.
The event aims to explore opportunities, pathways, and challenges related to advancing chip business ideas within the Chips Joint Undertaking (Chips JU) framework and to provide companies with a clear overview of the EU microchip ecosystem and the support mechanisms available through Chips JU. It provides a platform for knowledge exchange and shared learning while encouraging international collaboration. The summit also encourages business collaboration through matchmaking sessions and networking opportunities designed to help participants build new partnerships.
Additionally, the summit helps companies better understand pilot project requirements, technology readiness levels (TRL), co-funding structures, intellectual property considerations, and the pathway toward commercialisation. Through start-up showcases, success stories, and university involvement, the event demonstrates that entering the microchip sector is achievable for SMEs and startups across the Baltic-Nordic region and wider Europe.
🤝 The event is organized by LCCC and co-organized by Latvijas Mobilais Telefons (LMT), Estonian Chips Competence Centre (KIIP) and Chips Competence Centre Lithuania (Chips C2-LT).
ℹ️ If you have any questions regarding the forum, please contact Jānis at [email protected]!
Programme:
Please note that it is subject to change. The speakers will be added as the event date gets closer.
Main Room
8:30-9:00 | Registration & Coffee |
9:00-9:05 | Welcome and Introduction by the Moderator |
9:05-9:15 | Invited Policymaker Speeches: Minister for Economics: Viktors Valainis |
9:15-9:25 | Speeches by University Rectors: Riga Technical University Rector: Dr. Tālis Juhna, University of Latvia Rector: Dr. Gundars Bērziņš |
9:25-9:40 | Signing of a Memorandum of Cooperation between LCCC and LMT |
9:40-10:10 | The Keynote: Overview of the Current State of the European Semiconductor Ecosystem – SEMI Europe Perspective: SEMI Europe President: Laith Altimime |
10:10-10:40 | Enabling Start-ups and SMEs in Chips: The Role of the European Network of Chip Competence Centre: ACCCESS Coordinator: Dr. Régis Hamelin |
10:40-11:00 | Launch of Services by the Latvian Chip Competence Centre: Latvian Chip Competence Centre Partnerships Manager: Dr. Jānis Sperga |
11:00-11:30 | Coffee Break |
11:30-12:00 | EuroCDP (European Chips Design Platform) as a Pathway for Chip Design Development: EuroCDP Coordinator: Dr. Romano Hoofman |
12:00-12:15 | Infineon Presentation: Infineon Country Manager Poland: Jerzy Baratowicz |
12:15-12:30 | LMT Presentation: LMT Business Development Manager: Arturs Lalovs |
12:30-13:30 | Lunch |
Main Room (These activities happen simultaneously with the Breakout Room activities)
13:30-14:15 | Panel Discussion: Navigating Funding Pathways for Start-ups and SMEs in Chip Development Organised by KIIP, Panelists: TBA |
14:15-14:45 | Navigating IP and Strategy Challenges for Start-ups and SMEs in Chips: OneFab Nordic COO: Pasi Sillanpää |
14:45-15:45 | Trends in Photonic Integrated Circuits in Lithuania: Organised by Chips C2-LT Lithuanian PIC Ecosystem Snapshot and ChipsC²-LT Services Overview: Lithuanian Chip Competence Centre Manager: Dr. Saulius Tumėnas PIXEurope Presentation: Pilot Line Services and Access Conditions for European Industry: Research Team Leader, Silicon Photonics, VTT: Dr. Timo Aalto Presentation: PIC design and product perspective from a European industry player: Speaker: TBA Presentation: Regional industry view on PIC adoption, applications or supply chain integration: Speaker: TBA Joint discussion and audience Q&A |
15:45-16:00 | Coffee Break |
16:00-16:45 | Start-up Showcase: Invited Chip Start-ups Roster: TBA |
Breakout Room (These activities happen simultaneously with the Main Room activities)
14:15-14:45 | Entrepreneurial Ecosystems in the Semiconductor Industry: The New York State Experience: Dr. Mary Kathleen Burke |
14:45-15:15 | Latvia Spotlight: Invited Latvian Deep Tech Teams from BioPhot |
15:15-16:45 | Matchmaking and Networking Session, Moderated by FiCCC (Finnish Chip Competence Centre), with a Dedicated B2B Networking Lounge |
Main Room
16:45-17:00 | Closing Remarks |
Latvia Spotlight Teams:
Dr.Phys. Jana Andžāne
Flexible thermoelectric generators for self-powered microelectronics and sensorsDr.Phys. Arturs Bundulis
Polymer heterogeneous integration in inorganic photonic integrated chips (Phipic)Aleksejs Zolotarjovs, Ph.D.
Infrared Spectroscopy for In-Situ Detection of PFAS in Aquatic Environments Using a Submersible Sensing Platform – IR-senseProf. Sergejs Gaidukovs
Resilient Shielding for High-Integrity EMI Protected Cybersecurity ApplicationsDr.Chem. Artis Kinens
Optical Sensor Solution for Ammonia DetectionDr.Sc.Ing. Andis Supe
Optical filtering-based fiber Bragg grating sensor interrogator
🔗 Follow LCCC on LinkedIn for the latest news and updates about the event!
VEF Kamerzāle Spīdola • Ieriķu iela 5A, 1084 Rīga, Latvia
